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Customizable Glass-Sealed TO Header | Hermetic Metal Package for Semiconductor & Sensor Devices
| Plaats van herkomst | China |
|---|---|
| Merknaam | HUONA |
| Certificering | ISO9001 |
| Modelnummer | AAN |
| Min. bestelaantal | 100 stuks |
| Prijs | 30 |
| Verpakking Details | LADING |
| Levertijd | 15 dagen |
| Betalingscondities | T/T |
| Levering vermogen | 2000BTU |
Productdetails
| Productnaam | Naar kop | Alternatieve naam | NAAR metalen kop / hermetisch NAAR pakket |
|---|---|---|---|
| Pin-configuratie | Aanpasbaar | Afdichtingstechnologie | Glas-op-metaal hermetische afdichting |
| Oppervlaktebehandeling | Goud / nikkel / vertind | Pakkettype | Hermetisch TO-pakket |
| Productieproces | Precisie stempelen + glasafdichting | Kwaliteitscontrole | Hermetische test / elektrische test / visuele inspectie |
Productomschrijving
TO headers (TO package headers) are precision metal packages used for mounting semiconductor devices, laser diodes, and sensor modules that require hermetic sealing.
The metal body is typically made of Kovar alloy, stainless steel, or copper alloy, providing excellent mechanical strength and thermal stability. Glass-to-metal sealing ensures a reliable hermetic structure, protecting components from moisture, dust, and environmental contamination.
Our TO headers are fully customizable, including the number of leads, dimensions, plating type, and packaging, to meet specific device requirements.
Technical Parameters
| Item | Specification |
|---|---|
| Product Type | TO Header / TO Package |
| Base Material | Kovar Alloy / Stainless Steel / Copper Alloy |
| Glass Material | Borosilicate Glass |
| Lead Material | Kovar Pins |
| Lead Finish | Gold Plated / Nickel Plated / Tin Plated |
| Number of Leads | 2–10 pins, customizable |
| Sealing Type | Hermetic Glass-to-Metal Seal |
| Leak Rate | ≤1×10⁻⁹ Pa·m³/s |
| Insulation Resistance | ≥10⁹ Ω at 100 V DC |
| Operating Temperature | -55°C to +200°C |
| RoHS Compliance | Yes |
Custom Attributes
| Attribute | Value |
|---|---|
| Product Name | TO Header |
| Alternate Name | TO Metal Header / Hermetic TO Package |
| Pin Configuration | Customizable |
| Sealing Technology | Glass-to-Metal Hermetic Seal |
| Surface Treatment | Gold / Nickel / Tin Plating |
| Package Type | Hermetic TO Package |
| Manufacturing Process | Precision Stamping + Glass Sealing |
| Quality Control | Hermetic Test / Electrical Test / Visual Inspection |
| Certification | RoHS Compliant |
| Customization | Dimensions, pin number, plating, and packaging per customer request |
Product Features
- Hermetic Sealing: Reliable glass-to-metal sealing for extreme environments.
- High Mechanical Strength: Durable metal structure for long-term use.
- Excellent Thermal Stability: Performs well under temperature variations.
- Electrical Insulation: Prevents leakage and interference.
- Customizable Design: Pin configuration, size, plating, and packaging can be tailored.
Typical Applications
| Application Area | Example Use Case |
|---|---|
| Semiconductor Devices | Transistors, ICs |
| Laser & Optoelectronic Devices | Laser diodes, photodiodes |
| Sensor Modules | IR sensors, temperature/pressure sensors |
| Optical Communication | Transmitters, receivers, fiber modules |
| Aerospace Electronics | High reliability electronic modules |
| Medical Equipment | Precision detection systems |
Packaging & Delivery
| Item | Details |
|---|---|
| Packaging | Vacuum-sealed trays packed in export cartons |
| Lead Time | 7–15 working days depending on order quantity |
| Shipping | Air freight, sea freight, or international express |
| Traceability | Each tray labeled with lot number and product code |
| Minimum Order Quantity | Negotiable based on customization |
Customization Capability
Our R&D team can design and manufacture TO headers according to customer drawings and specifications. Customizable options include:
- Lead number and layout
- Dimensions and package size
- Plating type (gold, nickel, tin)
- Packaging solutions
Each custom order ensures reliability and meets the specific requirements of your devices.
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